BM314A Soft Solder Die Bonder is mainly applied to the die bonding of power semiconductor devices, and is ideal for power devices and PV modules, such as TO series, DPAK series, PDFN series, DFT modules, etc.
UPH
Up to 9K
Accuracy
±35μm@3σ
Wafer Size
≤12 inches
Oxygen Content
≤30mm
Optimal solution for the packaging of high-power devices
Outstanding tin writing and spanking effect, cutting-edge track temperature control system, capable of high-speed and high-accuracy die bonding and handling high-density leadframes
Ultra-thin wafer handling
Innovatively developed a high-precision bond head featuring full-travel constant force control for accurate control of both pickup and bonding force
Core indicator control
Oxygen content ≤20ppm, track heating temperature difference ≤±1℃, die placement accuracy ±35μm, tilt ＜30μm
Modular design
Interchangeable tin writing and spanking modules, auto wafer load/unload, multiple loading modes
Visualized system
IQC data monitoring system, production report generation system, bond force control curve simulation system
English
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