BM313A Multifunction Die Bonder is mainly designed for the die bonding of semiconductor SiC pressure-assisted Ag sintering products, and can be extended to the die bonding of optical modules, sensors and metal packages in the future.
UPH
Up to 1000
Accuracy
±10μm@3σ
Wafer Size
≤12 inches
Bond Force
30kg
High-end domestic substitute of choice
Gain customer confidence and preference with high-speed and high-accuracy die bonding, modular design for flexible configuration, and stable and reliable performance
Precise control
High-accuracy X/Y/Z control, closed-loop and programmable force and temp control, auto accuracy calibration system, multi-function camera system
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