The JX300FP is a leading 12-inch CMP Tool developed based on ATW JX's advanced CMP technology, in response to cutting-edge industry demands. This equipment is equipped with high-performance polishing units and integrates advanced combined cleaning technology, delivering superior cleaning results. It enables nanometer-level global planarization of substrates, meeting the requirements of advanced process technologies.
Wafer Size
≤12 inches
GBIR
＜100nm
Polishing Head
3-8Zone
Load&Unload
Dry in dry out
Transcending conventional approaches
Integrating polishing and cleaning into one, and combining technological advantages, with stability as the cornerstone and innovation as the cutting edge
High Throughput
Featuring 8 polishing heads and 3 workstations for enhanced productivity.
Multi-zone Polishing Head
Adjustable pressure for 3 to 8 zones, enabling high-precision surface profile control.
Integrated Cleaning Unit
Equipped with advanced cleaning technology, ensuring dry-in and dry-out processing.
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