The FTB300FP CMP Tool is jointly developed by JieXin and a Japanese technical team. This equipment is designed for high throughput and cost-effectiveness while improving planarization performance to meet higher technical requirements (GBIR, SFQR).
Wafer Size
≤12 inches
GBIR
＜100nm
Load&Unload
Dry in wet out
High-end domestic substitute of choice
Reliability and stability-driven high-end domestic substitute
High Throughput
Equipped with 8 polishing heads and 3 workstations for enhanced productivity.
Flexible Process Integration
The robotic unloader can be combined with the cleaning system for drying treatment.
Low Overall Cost
The consumables are easy to replace, have a long service life, and thus reduce downtime.
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